Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD
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Updated Oct 29, 2026
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A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.
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Access the complete Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD on the official website.
Modified Apr 29, 2026